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Union Semiconductor (Hefei) Co (SHSE:688403) Total Current Assets : ¥639 Mil (As of Mar. 2024)


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What is Union Semiconductor (Hefei) Co Total Current Assets?

Total current assets includes Cash, Cash Equivalents, Marketable Securities, Total Receivables, Total Inventories, and Other Current Assets. Union Semiconductor (Hefei) Co's total current assets for the quarter that ended in Mar. 2024 was ¥639 Mil.


Union Semiconductor (Hefei) Co Total Current Assets Historical Data

The historical data trend for Union Semiconductor (Hefei) Co's Total Current Assets can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Union Semiconductor (Hefei) Co Total Current Assets Chart

Union Semiconductor (Hefei) Co Annual Data
Trend Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Total Current Assets
Get a 7-Day Free Trial 329.57 402.56 465.41 1,175.82 652.55

Union Semiconductor (Hefei) Co Quarterly Data
Dec18 Dec19 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Total Current Assets Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 987.36 893.04 688.73 652.55 639.26

Union Semiconductor (Hefei) Co Total Current Assets Calculation

Total Current Assets are the asset that can be converted to cash or used to pay current liabilities within 12 months.

Union Semiconductor (Hefei) Co's Total Current Assets for the fiscal year that ended in Dec. 2023 is calculated as

Union Semiconductor (Hefei) Co's Total Current Assets for the quarter that ended in Mar. 2024 is calculated as

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

Total Current Assets is linked to the Current Ratio, which is the result of dividing total current assets by total current liabilities. It is frequently used as an indicator of a company's liquidity, its ability to meet short-term obligations.

Total Current Assets is also linked to Working Capital, Net working capital is calculated as Total Current Assets minus Total Current Liabilities.


Union Semiconductor (Hefei) Co  (SHSE:688403) Total Current Assets Explanation

In Ben Graham's calculation of liquidation value, inventory is only considered worth half of its book value, and accounts receivable is considered worth 75% of its value. Therefore the liquidation value is lower than calculated from total current assets.

Union Semiconductor (Hefei) Co's Liquidation Value for the quarter that ended in Mar. 2024 is

Liquidation value
= Cash, Cash Equivalents, Marketable Securities-Total Liabilities+(0.75 * Accounts Receivable)+(0.5 * Total Inventories)
=90.211-586.304+0.75 * 201.827+0.5 * 254.317
=-218

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Union Semiconductor (Hefei) Co Total Current Assets Related Terms

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Union Semiconductor (Hefei) Co (SHSE:688403) Business Description

Traded in Other Exchanges
N/A
Address
Hefei Comprehensive Bonded Zone, Xinzhan District, Anhui Province, Hefei, CHN, 230012
Union Semiconductor (Hefei) Co Ltd is a high-end advanced packaging and testing service provider for integrated circuits. It focuses on the field of display driver chips. The company's main business is the front-end gold bumping manufacturing as the core and integrates wafer testing, back-end chip-on-glass, and chip-on-film links to form a full range of display driver chips.

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