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Union Semiconductor (Hefei) Co (SHSE:688403) Buildings And Improvements : ¥0 Mil (As of Mar. 2024)


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What is Union Semiconductor (Hefei) Co Buildings And Improvements?


Union Semiconductor (Hefei) Co Buildings And Improvements Historical Data

The historical data trend for Union Semiconductor (Hefei) Co's Buildings And Improvements can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Union Semiconductor (Hefei) Co Buildings And Improvements Chart

Union Semiconductor (Hefei) Co Annual Data
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Buildings And Improvements
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Union Semiconductor (Hefei) Co Quarterly Data
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Union Semiconductor (Hefei) Co Buildings And Improvements Calculation

Buildings are typically valued at the time of acquisition or construction.  Broker and architect fees, permits, etc. can be covered within this category.  Building components, such as a roof, are normally recorded separately in an asset register since the value and useful lives of these components equal much less than the building itself.

Building improvements that extend the useful life of a building will fall into the category of “building improvements” and should be capitalized.  Improvements are commonly recorded at acquisition cost.  Building improvement examples include roofing, remodeling, replacements, etc.


Union Semiconductor (Hefei) Co (SHSE:688403) Business Description

Traded in Other Exchanges
N/A
Address
Hefei Comprehensive Bonded Zone, Xinzhan District, Anhui Province, Hefei, CHN, 230012
Union Semiconductor (Hefei) Co Ltd is a high-end advanced packaging and testing service provider for integrated circuits. It focuses on the field of display driver chips. The company's main business is the front-end gold bumping manufacturing as the core and integrates wafer testing, back-end chip-on-glass, and chip-on-film links to form a full range of display driver chips.

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