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Union Semiconductor (Hefei) Co (SHSE:688403) Debt-to-Asset : 0.09 (As of Mar. 2024)


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What is Union Semiconductor (Hefei) Co Debt-to-Asset?

Union Semiconductor (Hefei) Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥289 Mil. Union Semiconductor (Hefei) Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥21 Mil. Union Semiconductor (Hefei) Co's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2024 was ¥3,668 Mil. Union Semiconductor (Hefei) Co's debt to asset for the quarter that ended in Mar. 2024 was 0.08.


Union Semiconductor (Hefei) Co Debt-to-Asset Historical Data

The historical data trend for Union Semiconductor (Hefei) Co's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Union Semiconductor (Hefei) Co Debt-to-Asset Chart

Union Semiconductor (Hefei) Co Annual Data
Trend Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Asset
Get a 7-Day Free Trial 0.30 0.24 0.22 - 0.05

Union Semiconductor (Hefei) Co Quarterly Data
Dec18 Dec19 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only - - 0.01 0.05 0.09

Competitive Comparison of Union Semiconductor (Hefei) Co's Debt-to-Asset

For the Semiconductors subindustry, Union Semiconductor (Hefei) Co's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Union Semiconductor (Hefei) Co's Debt-to-Asset Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Union Semiconductor (Hefei) Co's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Union Semiconductor (Hefei) Co's Debt-to-Asset falls into.



Union Semiconductor (Hefei) Co Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Union Semiconductor (Hefei) Co's Debt-to-Asset for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(187.955 + 1.269) / 3596.297
=0.05

Union Semiconductor (Hefei) Co's Debt-to-Asset for the quarter that ended in Mar. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(289.427 + 20.936) / 3668.458
=0.08

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Union Semiconductor (Hefei) Co  (SHSE:688403) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


Union Semiconductor (Hefei) Co Debt-to-Asset Related Terms

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Union Semiconductor (Hefei) Co (SHSE:688403) Business Description

Traded in Other Exchanges
N/A
Address
Hefei Comprehensive Bonded Zone, Xinzhan District, Anhui Province, Hefei, CHN, 230012
Union Semiconductor (Hefei) Co Ltd is a high-end advanced packaging and testing service provider for integrated circuits. It focuses on the field of display driver chips. The company's main business is the front-end gold bumping manufacturing as the core and integrates wafer testing, back-end chip-on-glass, and chip-on-film links to form a full range of display driver chips.

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