GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » TongFu Microelectronics Co Ltd (SZSE:002156) » Definitions » Financial Strength

TongFu Microelectronics Co (SZSE:002156) Financial Strength : 3 (As of Mar. 2024)


View and export this data going back to 2007. Start your Free Trial

What is TongFu Microelectronics Co Financial Strength?

TongFu Microelectronics Co has the Financial Strength Rank of 3. It displays poor financial strength and is likely in financial distress. Usually this is caused by too much debt for the company.

Warning Sign:

TongFu Microelectronics Co Ltd displays poor financial strength. Usually, this is caused by too much debt for the company.

GuruFocus Financial Strength Rank measures how strong a company's financial situation is. It is based on these factors:

1. The debt burden that the company has as measured by its Interest Coverage (current year). The higher, the better.
2. Debt to revenue ratio. The lower, the better.
3. Altman Z-Score.

TongFu Microelectronics Co's Interest Coverage for the quarter that ended in Mar. 2024 was 1.89. TongFu Microelectronics Co's debt to revenue ratio for the quarter that ended in Mar. 2024 was 0.68. As of today, TongFu Microelectronics Co's Altman Z-Score is 1.77.


Competitive Comparison of TongFu Microelectronics Co's Financial Strength

For the Semiconductor Equipment & Materials subindustry, TongFu Microelectronics Co's Financial Strength, along with its competitors' market caps and Financial Strength data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


TongFu Microelectronics Co's Financial Strength Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, TongFu Microelectronics Co's Financial Strength distribution charts can be found below:

* The bar in red indicates where TongFu Microelectronics Co's Financial Strength falls into.



TongFu Microelectronics Co Financial Strength Calculation

GuruFocus Financial Strength Rank measures how strong a company's financial situation is. It is based on these factors

A company ranks high with financial strength is likely to withstand any business slowdowns and recessions.

1. The debt burden that the company has as measured by its Interest Coverage (current year). The higher, the better.

Note: If both Interest Expense and Interest Income are empty, while Net Interest Income is negative, then use Net Interest Income as Interest Expense.

Interest Coverage is a ratio that determines how easily a company can pay interest expenses on outstanding debt. It is calculated by dividing a company's Operating Income (EBIT) by its Interest Expense:

TongFu Microelectronics Co's Interest Expense for the months ended in Mar. 2024 was ¥-136 Mil. Its Operating Income for the months ended in Mar. 2024 was ¥256 Mil. And its Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥6,890 Mil.

TongFu Microelectronics Co's Interest Coverage for the quarter that ended in Mar. 2024 is

Interest Coverage=-1*Operating Income (Q: Mar. 2024 )/Interest Expense (Q: Mar. 2024 )
=-1*256.481/-135.89
=1.89

The higher the ratio, the stronger the company's financial strength is.

Warning Sign:

Ben Graham prefers companies' interest coverage to be at least 5. TongFu Microelectronics Co Ltd interest coverage is 2.11, which is low.

2. Debt to revenue ratio. The lower, the better.

TongFu Microelectronics Co's Debt to Revenue Ratio for the quarter that ended in Mar. 2024 is

Debt to Revenue Ratio=Total Debt (Q: Mar. 2024 ) / Revenue
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Revenue
=(7409.371 + 6889.554) / 21128.096
=0.68

3. Altman Z-Score.

Z-Score model is an accurate forecaster of failure up to two years prior to distress. It can be considered the assessment of the distress of industrial corporations.

The zones of discrimination were as such:

When Z-Score is less than 1.81, it is in Distress Zones.
When Z-Score is greater than 2.99, it is in Safe Zones.
When Z-Score is between 1.81 and 2.99, it is in Grey Zones.

TongFu Microelectronics Co has a Z-score of 1.77, indicating it is in Distress Zones. This implies bankrupcy possibility in the next two years.

Warning Sign:

Altman Z-score of 1.77 is in distress zone. This implies bankruptcy possibility in the next two years.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


TongFu Microelectronics Co  (SZSE:002156) Financial Strength Explanation

The maximum rank is 10. Companies with rank 7 or higher will be unlikely to fall into distressed situations. Companies with rank of 3 or less are likely in financial distress.

TongFu Microelectronics Co has the Financial Strength Rank of 3. It displays poor financial strength and is likely in financial distress. Usually this is caused by too much debt for the company.


TongFu Microelectronics Co Financial Strength Related Terms

Thank you for viewing the detailed overview of TongFu Microelectronics Co's Financial Strength provided by GuruFocus.com. Please click on the following links to see related term pages.


TongFu Microelectronics Co (SZSE:002156) Business Description

Traded in Other Exchanges
N/A
Address
No. 288 Chongchuan Road, Chongchuan Development Zone, Jiangsu province, Nantong, CHN, 226006
TongFu Microelectronics Co Ltd operates in the semiconductor industry. The company is specializing in integrated circuit assembling and testing. The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed-signal, automotive, radio frequency, digital semiconductor devices, baseband, and application specific integrated circuits. Its other products and services include wafer bump services, probe, final test and post-test services.

TongFu Microelectronics Co (SZSE:002156) Headlines

No Headlines