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TongFu Microelectronics Co (SZSE:002156) Debt-to-EBITDA : 13.65 (As of Mar. 2024)


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What is TongFu Microelectronics Co Debt-to-EBITDA?

Debt-to-EBITDA measures a company's ability to pay off its debt.

TongFu Microelectronics Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥7,409 Mil. TongFu Microelectronics Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥6,890 Mil. TongFu Microelectronics Co's annualized EBITDA for the quarter that ended in Mar. 2024 was ¥1,047 Mil. TongFu Microelectronics Co's annualized Debt-to-EBITDA for the quarter that ended in Mar. 2024 was 13.65.

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt. According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.

The historical rank and industry rank for TongFu Microelectronics Co's Debt-to-EBITDA or its related term are showing as below:

SZSE:002156' s Debt-to-EBITDA Range Over the Past 10 Years
Min: 1.61   Med: 2.76   Max: 13.85
Current: 13.85

During the past 13 years, the highest Debt-to-EBITDA Ratio of TongFu Microelectronics Co was 13.85. The lowest was 1.61. And the median was 2.76.

SZSE:002156's Debt-to-EBITDA is ranked worse than
94.33% of 706 companies
in the Semiconductors industry
Industry Median: 1.595 vs SZSE:002156: 13.85

TongFu Microelectronics Co Debt-to-EBITDA Historical Data

The historical data trend for TongFu Microelectronics Co's Debt-to-EBITDA can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

TongFu Microelectronics Co Debt-to-EBITDA Chart

TongFu Microelectronics Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-EBITDA
Get a 7-Day Free Trial Premium Member Only Premium Member Only 4.10 3.11 2.88 3.18 3.20

TongFu Microelectronics Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-EBITDA Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 49.71 -28.79 10.16 6.56 13.65

Competitive Comparison of TongFu Microelectronics Co's Debt-to-EBITDA

For the Semiconductor Equipment & Materials subindustry, TongFu Microelectronics Co's Debt-to-EBITDA, along with its competitors' market caps and Debt-to-EBITDA data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


TongFu Microelectronics Co's Debt-to-EBITDA Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, TongFu Microelectronics Co's Debt-to-EBITDA distribution charts can be found below:

* The bar in red indicates where TongFu Microelectronics Co's Debt-to-EBITDA falls into.



TongFu Microelectronics Co Debt-to-EBITDA Calculation

Debt-to-EBITDA measures a company's ability to pay off its debt.

TongFu Microelectronics Co's Debt-to-EBITDA for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(8005.641 + 6002.589) / 4383.964
=3.20

TongFu Microelectronics Co's annualized Debt-to-EBITDA for the quarter that ended in Mar. 2024 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(7409.371 + 6889.554) / 1047.228
=13.65

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

In the calculation of annual Debt-to-EBITDA, the EBITDA of the last fiscal year is used. In calculating the annualized quarterly data, the EBITDA data used here is four times the quarterly (Mar. 2024) EBITDA data.


TongFu Microelectronics Co  (SZSE:002156) Debt-to-EBITDA Explanation

In the calculation of Debt-to-EBITDA, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by EBITDA. In some calculations, Total Liabilities is used to for calculation.


Be Aware

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt.

According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.


TongFu Microelectronics Co Debt-to-EBITDA Related Terms

Thank you for viewing the detailed overview of TongFu Microelectronics Co's Debt-to-EBITDA provided by GuruFocus.com. Please click on the following links to see related term pages.


TongFu Microelectronics Co (SZSE:002156) Business Description

Traded in Other Exchanges
N/A
Address
No. 288 Chongchuan Road, Chongchuan Development Zone, Jiangsu province, Nantong, CHN, 226006
TongFu Microelectronics Co Ltd operates in the semiconductor industry. The company is specializing in integrated circuit assembling and testing. The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed-signal, automotive, radio frequency, digital semiconductor devices, baseband, and application specific integrated circuits. Its other products and services include wafer bump services, probe, final test and post-test services.

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