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T-Flex Techvest PCB Co (ROCO:3276) LT-Debt-to-Total-Asset : 0.04 (As of Mar. 2024)


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What is T-Flex Techvest PCB Co LT-Debt-to-Total-Asset?

LT Debt to Total Assets is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. It is calculated as a company's Long-Term Debt & Capital Lease Obligationdivide by its Total Assets. T-Flex Techvest PCB Co's long-term debt to total assests ratio for the quarter that ended in Mar. 2024 was 0.04.

T-Flex Techvest PCB Co's long-term debt to total assets ratio declined from Mar. 2023 (0.06) to Mar. 2024 (0.04). It may suggest that T-Flex Techvest PCB Co is progressively becoming less dependent on debt to grow their business.


T-Flex Techvest PCB Co LT-Debt-to-Total-Asset Historical Data

The historical data trend for T-Flex Techvest PCB Co's LT-Debt-to-Total-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

T-Flex Techvest PCB Co LT-Debt-to-Total-Asset Chart

T-Flex Techvest PCB Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
LT-Debt-to-Total-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.14 0.08 0.04 0.07 0.05

T-Flex Techvest PCB Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
LT-Debt-to-Total-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.06 0.06 0.06 0.05 0.04

T-Flex Techvest PCB Co LT-Debt-to-Total-Asset Calculation

T-Flex Techvest PCB Co's Long-Term Debt to Total Asset Ratio for the fiscal year that ended in Dec. 2023 is calculated as

LT Debt to Total Assets (A: Dec. 2023 )=Long-Term Debt & Capital Lease Obligation (A: Dec. 2023 )/Total Assets (A: Dec. 2023 )
=86.72/1733.14
=0.05

T-Flex Techvest PCB Co's Long-Term Debt to Total Asset Ratio for the quarter that ended in Mar. 2024 is calculated as

LT Debt to Total Assets (Q: Mar. 2024 )=Long-Term Debt & Capital Lease Obligation (Q: Mar. 2024 )/Total Assets (Q: Mar. 2024 )
=64.026/1714.187
=0.04

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


T-Flex Techvest PCB Co  (ROCO:3276) LT-Debt-to-Total-Asset Explanation

LT Debt to Total Asset is a measurement representing the percentage of a corporation's assets that are financed with loans and financial obligations lasting more than one year. The ratio provides a general measure of the financial position of a company, including its ability to meet financial requirements for outstanding loans. A year-over-year decrease in this metric would suggest the company is progressively becoming less dependent on debt to grow their business.


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T-Flex Techvest PCB Co (ROCO:3276) Business Description

Traded in Other Exchanges
N/A
Address
No. 12, Gongye 2nd Road, No. 352, Section 2, Pingzhen District, Taoyuan, TWN, 324
T-Flex Techvest PCB Co Ltd is an equipment manufacturer of electronic components. The company is engaged in the manufacturing, processing, purchase, and sale of electronic parts and components and printed circuit boards (PCB). It offers high-level PCB (Printed Circuit Board) inner and outer layer printed circuit board lamination. The company products include mobile phone boards, communication boards, motherboards, photoelectric boards, HDI boards, and others.

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