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Mimasu Semiconductor Industry Co (TSE:8155) Long-Term Debt : 円0 Mil (As of Feb. 2024)


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What is Mimasu Semiconductor Industry Co Long-Term Debt?

Mimasu Semiconductor Industry Co's Long-Term Debt for the quarter that ended in Feb. 2024 was 円0 Mil.


Mimasu Semiconductor Industry Co Long-Term Debt Historical Data

The historical data trend for Mimasu Semiconductor Industry Co's Long-Term Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Mimasu Semiconductor Industry Co Long-Term Debt Chart

Mimasu Semiconductor Industry Co Annual Data
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Long-Term Debt
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Mimasu Semiconductor Industry Co Quarterly Data
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Mimasu Semiconductor Industry Co  (TSE:8155) Long-Term Debt Explanation

Long-Term Debt is the sum of the carrying values as of the balance sheet date of all long-term debt, which is debt initially having maturities due after one year or beyond the operating cycle, if longer, but excluding the portions thereof scheduled to be repaid within one year or the normal operating cycle, if longer. Long-Term Debt includes notes payable, bonds payable, mortgage loans, convertible debt, subordinated debt and other types of long term debt.


Mimasu Semiconductor Industry Co Long-Term Debt Related Terms

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Mimasu Semiconductor Industry Co (TSE:8155) Business Description

Traded in Other Exchanges
N/A
Address
2174-1 Hododa-machi, Takasaki-shi, Gunma, JPN, 370-3533
Mimasu Semiconductor Industry Co Ltd is a Japan-based company, engages in the processing of semiconductor materials. The Semiconductor division includes processing and sales of semiconductor materials. The Industrial sales segment includes measuring instruments, testing machines, information equipment, automatic control equipment other precision equipment, in-house developed products, and related systems sales. The Engineering division is engaged in the provision of various automatic devices, such as processing equipment for semiconductor materials, robot systems, and others.

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