- Axcelis Technologies (ACLS, Financial) will present a new hardware technology at ASMC 2025, enhancing low-energy boron implantation.
- The presentation will focus on reducing particle contamination, thereby improving semiconductor device yields.
- Axcelis' research is in collaboration with SK Hynix, featuring enhancements to self-sputtering film techniques.
Axcelis Technologies, Inc. (NASDAQ: ACLS) has recently issued a correction to its previous press release concerning the Advanced Semiconductor Manufacturing Conference (ASMC), which the company will sponsor from May 5-8, 2025, at the Hilton Albany, New York. The correction involves the names of two coauthors, where Charlie Free was previously listed as David Free, and DaeYoon Kim was stated as Dae Yun Kim.
During the ASMC, Dr. Phillip Geissbuhler, a Staff Scientist at Axcelis, will present research on 'Particle Control for Low-Energy Boron Implantation' on May 6, 2025, at 3:40 PM. This research is part of Session 5: Contamination Free Manufacturing. The study highlights how the introduction of new hardware can reduce particle contamination during boron implantation processes by increasing the ion beam angle. This advance enhances self-sputtering of films, thus significantly reducing film buildup on surfaces near the implanted wafers, ultimately improving device yields.
The presentation is a joint effort between Axcelis Technologies, including contributors Dr. Phillip Geissbuhler, David Burtner, Charlie Free, Kevin Wenzel, Luke Kim, DaeYoon Kim, BuMin Son, and SK Hynix representatives HunKyu Cha and SangHyun Na. This collaboration underscores the importance of reducing contamination in semiconductor manufacturing to optimize device performance.
Axcelis Technologies, headquartered in Beverly, Mass., is a leader in semiconductor ion implantation solutions, providing innovative and high-productivity options essential for the industry. The company has been at the forefront of developing process applications to support the entire lifecycle of ion implantation systems, a critical step in integrated circuit manufacturing.
