Taiwan Semiconductor Manufacturing Company (TSM) has unveiled its groundbreaking A14 process technology, which represents a 1.4-nanometer advancement. This new node is set to enter mass production in 2028. Analysts expect Apple (AAPL, Financial), TSM's largest client, to pioneer the integration of this technology in its iPhone 19, slated for release in the same year.
The A14 process is an enhancement over the existing 2-nanometer node (N2), promising a 15% performance boost at the same power level or a 30% power reduction at the same performance level, along with a 20% increase in logic density. These improvements are aimed at enhancing the capabilities of smartphones and AI servers. The N2 process is expected to begin mass production in 2025, with applications in the iPhone 17 Pro chipset, paving the way for the A14 node's deployment three years later.
Despite not confirming which client will first adopt the A14 process, TSM's previous collaborations suggest Apple as the frontrunner. This advancement is expected to bolster Apple's competitive edge in high-end mobile chip technology for the future.
