- Alpha and Omega Semiconductor (AOSL, Financial) will showcase innovative power management solutions at PCIM 2025 in Nuremberg, Germany.
- New products include the Generation 3 1200V SiC MOSFET technology and Mega IPM-7 for motor control applications.
- Debuts will also include new 60V and 100V driver ICs, hot swap controllers, and advanced packaging solutions.
Alpha and Omega Semiconductor Limited (Nasdaq: AOSL) has announced its participation in PCIM 2025, taking place from May 6-8 in Nuremberg, Germany. The company is set to present its latest advancements in power management technologies tailored to key application markets.
AOS will unveil its Generation 3 1200V SiC MOSFET technology, offering a 20-30% loss improvement over previous generations without sacrificing robustness. These MOSFETs, available initially in TO247-4L packages from 15mohm to 40mohm, are AEC-Q101 qualified and designed for harsh environments.
The company will also showcase its Mega IPM-7, incorporating the latest G2 IGBT and a high-voltage gate driver into a compact package, delivering up to 100W for motor control. Available in 600V configurations, this product range includes Mega IPM-7D, IPM-7DT, and IPM-7E packages.
In addition, AOS is set to release new 60V and 100V driver ICs targeting power tools, outdoor garden equipment, and e-mobility applications, featuring 100V half-bridge and 3-phase driver ICs, and 60V 3-phase driver ICs.
The company's upcoming 12V/60A eFuse products, combining hot swap controllers and power MOSFETs into a single package, are designed to enhance system reliability by isolating loads from the main power rails during fault conditions.
Finally, AOS will demonstrate advanced packaging solutions, including their efficient 25V-150V MOSFETs in double-sided cooling DFN 5x6 packages and other robust options like LFPAK and GLPAK, designed for better heat transfer and reliability.
