- Axcelis Technologies (ACLS, Financial) to participate in the Advanced Semiconductor Manufacturing Conference (ASMC) in May 2025.
- Dr. Phillip Geissbuhler will present research on particle control to improve semiconductor yields.
- Collaboration with SK Hynix on innovative hardware technology to reduce contamination.
Axcelis Technologies, Inc. (NASDAQ: ACLS), a leading provider of ion implantation solutions, has announced its sponsorship and participation in the Advanced Semiconductor Manufacturing Conference (ASMC) from May 5 to May 8, 2025, in Albany, New York.
The company will showcase groundbreaking research on particle control in the fifth session of the conference, titled "Contamination Free Manufacturing." The presentation, scheduled for May 6, 2025, will be delivered by Dr. Phillip Geissbuhler, a Staff Scientist at Axcelis.
The research is a result of a collaborative effort between Axcelis and SK Hynix. The study introduces new hardware that enhances self-sputtering of films by increasing the ion beam angles during low-energy boron implantations. This innovation significantly reduces the buildup of boron films on surfaces near implanted wafers, a critical issue in semiconductor manufacturing that affects yield.
Russell Low, President and CEO of Axcelis, expressed excitement about the company's involvement in ASMC and highlighted the importance of the technical collaboration with SK Hynix. He emphasized Axcelis's commitment to sharing insights and recommendations to optimize device performance and yield in semiconductor manufacturing.
For over 45 years, Axcelis, headquartered in Beverly, Mass., has been at the forefront of providing high-productivity solutions for the semiconductor industry. To learn more about Axcelis and its innovative solutions, visit their website.
