- Cadence (CDNS, Financial) strengthens its collaboration with TSMC, advancing AI and 3D-IC chip design.
- New certified design solutions for TSMC’s A16 and N2P process technologies are announced.
- Cadence expands its 3DFabric® solution, optimizing design IP for AI and automotive applications.
Cadence Design Systems, Inc. (CDNS) continues to deepen its partnership with TSMC by advancing AI and 3D-IC chip design capabilities. The collaboration focuses on certified design solutions for TSMC's A16 and N2P process technologies, aiming to accelerate time to silicon for 3D-IC and advanced-node technologies.
Through this partnership, Cadence provides certified tools and silicon-proven IP for TSMC's advanced process nodes, including N2P, N5, and N3. This move enhances digital design flows for future process nodes and integrates AI-driven design solutions like large language models (LLMs) to improve efficiency and innovation.
The collaboration also emphasizes the development of leading-edge automotive solutions by optimizing Cadence’s design IP portfolio for TSMC's N5A and N3A processes, supporting advancements in ADAS, autonomous driving, and software-defined vehicles with high-performance features like LPDDR5X-9600 and PCI Express® 5.0.
Moreover, Cadence is expanding its 3DFabric® solution, providing comprehensive chiplet design, packaging, and system analysis options for TSMC's ecosystem. The company offers TSMC 9000-certified IP for 3D-IC design, including HBM3E solutions in N5/N4P and N3P, facilitating advanced AI training and automotive applications.
Cadence's commitment to innovation is further evidenced by its support for TSMC's compact universal photonic engine (COUPE™) and enabling next-generation design solutions in the cloud with GPU-accelerated compute for enhanced performance.
This ongoing collaboration demonstrates Cadence's dedication to empowering designers with cutting-edge solutions, driving technological advancements across various industries, including AI, automotive, and semiconductor design.
