Shares of Taiwan Semiconductor Manufacturing Company (TSM, Financial) climbed nearly 1% in pre-market trading, reaching $157.29. This rise follows reports from Nikkei that TSMC is nearing completion of its research and development in panel-level advanced chip packaging (PLP). The company plans to commence small-scale production around 2027. This technology shift aims to satisfy the increasing demand for powerful AI chips, using square substrates capable of housing more semiconductors compared to traditional round ones.
Additionally, AMD announced that its next-generation Zen6 EPYC processor, named Venice, has completed the initial production phase. This processor is noted as the industry’s first high-performance computing processor to utilize TSMC's 2nm process technology.
