- Applied Materials (AMAT, Financial) acquires a 9% stake in BE Semiconductor Industries (Besi).
- The investment enhances their collaboration in hybrid bonding technology for advanced semiconductor packaging.
- AMAT will not seek board representation or acquire more shares in Besi.
Applied Materials (AMAT) has strategically acquired a 9% stake in BE Semiconductor Industries (Besi) to bolster their ongoing partnership in developing hybrid bonding technology, a crucial advancement in semiconductor packaging. This investment follows a successful collaboration since 2020 and their recent agreement to enhance hybrid bonding solutions.
Hybrid bonding technology facilitates direct copper-to-copper connections between chips, significantly improving performance, reducing power consumption, and lowering costs. These benefits are particularly important for the creation of advanced logic and memory chips, especially those used in AI applications.
The comprehensive hybrid bonding system, co-developed by AMAT and Besi, merges Applied Materials' expertise in front-end wafer and chip processing with Besi's capabilities in die placement, interconnect, and assembly solutions. This system is designed for high-volume manufacturing, aimed at meeting the industry's demands for next-generation semiconductor chips.
Applied Materials' investment was conducted through market-based transactions, requiring no regulatory approvals, and the company has clarified that it does not intend to seek board representation at Besi or purchase additional shares. This strategic move aligns with AMAT's commitment to advancing technology for next-generation AI chips, positioning itself in a high-growth segment of the semiconductor equipment market.
