Morgan Stanley projects NVIDIA's (NVDA, Financial) next-generation Rubin GPU will enter the tape-out phase in the latter half of 2025, six months earlier than previously planned. The Rubin GPU, utilizing 3nm technology, CPO, and HBM4, will be twice the size of its predecessor, Blackwell, with four computing chips. This advancement is expected to benefit companies in the supply chain.
Analyst Charlie Chan notes that despite ongoing production of Blackwell chips, preparations for the complex Rubin GPU are underway. TSMC is expected to expand its CoWoS capacity by 2026, contingent on AI capital expenditure sustainability. However, ASMPT faces delays in TCB tool certification, crucial for Rubin's CoW process.
